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BH2227FV, BH2228FV
Technical Note
7/8
www.rohm.com
2011.08 - Rev.B
2011 ROHM Co., Ltd. All rights reserved.
●Operation Notes
(1) Absolute maximum ratings
Operating or testing the device over the maximum specifications may damage the part itself as well as peripheral
components. Therefore, please ensure that the specifications are not exceeded.
(2) GND potential
Ensure that the GND terminal is at the lowest potential under all operating conditions.
(3) Thermal design
Use a thermal design that allows for a sufficient margin regarding power dissipation (Pd) under actual operating
conditions.
(4) Terminal shorts and mis-mounting
Incorrect orientation or misalignment of the IC when mounting to the PCB may damage part. Short-circuits caused by The
introduction of foreign matter between the output terminals or across the output and power supply or GND may also
result in destruction.
(5) Operation in a strong magnetic field
Operation in a strong electromagnetic field may cause malfunction.
(6) Set the power source voltage so that VDD ≧ VFS.
(7) Reset function
The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons.
Therefore, set the time constant so as to satisfy the power source rise time.
●Thermal Derating Curve
·SSOP-B14
Board size : 70 x 70 x 1.6mm
Material : FR4 glass epoxy board (copper foil area less than 3%)
Fig.18
0
100
200
300
400
500
0
25
50
75
100
125
Ta [℃]
PD
[mW]
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